KEY FEATURES

Triglav™ - newly designed UHR electron column

• - TriLens™ - objective system: a unique combination of three-lens objective and crossover-free beam path
• - Advanced detection system with multiple SE and BSE detectors - TriSE™ and TriBE™
• - Triglav™ - Ultimate ultra-high resolution at low beam energy: 0.9 nm at 1 keV and 0.6 nm at 15 keV
• - Electron beam currents up to 400 nA and rapid beam energy changes
• - Optimized column geometry for accommodating large wafers up to 8”, 12”

 Orage™ FIB column

High-performance Ga FIB column for ultimate precision in nanoengineering.

• - Prepare high-quality, ultra-thin TEM lamella from the most advanced semiconductor nodes

  - Easily obtain advanced geometry TEM lamella using  optimized in-situ lift-out geometries and workflows

  - AutoSlicer™ module for semi-automated FIB milling and TEM lamella preparation

  - Gentle FIB thinning for improved quality results in TEM sample preparation

  - Precise end-pointing at low kV for ultra-thin lamella preparation

  - Use low kV, ultra-high resolution imaging for beam sensitive materials or to generate high materials contrast

  - Essence™ easy-to-use modular user interface